Build-To-Print assembly (BTP): transport and storage tool for a high-tech semiconductor module

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Zest

The advantages

  • Logistical relief - Supply chain management and integration of critical components;
  • Efficient assembly - Optimal configuration and minimal Technical Product Documentation (TPD);
  • Manufacturability optimization - Engineering feedback for improved manufacturability and repeatability;

At ZEST-Innovate we realize Build-To-Print (BTP) tools, where we take care of the complete assembly and logistics based on the design of our customer. In this way we relieve our customer of the entire process from drawing to first use. A recent project concerns a transport and storage tool for a high-tech semiconductor module. This tool ensures accurate positioning and protected handling of critical components within the production process.